iNPACK
@ICModules
iNPACK offers cutting-edge OSAT solutions including testing and IC package and Substrate design LGA, BGA 2D & 3D modules.
Our new eBook: Articles written by IC Packaging experts that explore challenges and solutions in IC Packaging design, FAB, complex processes, and more. Our eBook contains vital information for IC package designers & engineers lp.pcb-technologies.com/ic-packaging-e…
𝗶𝗡𝗣𝗔𝗖𝗞 𝗮𝘁 𝗜𝗠𝗔𝗣𝗦 𝗦𝗮𝗻 𝗗𝗶𝗲𝗴𝗼 2025 Booth #702 Showcasing All-In-One Solutions: Custom IC Packaging, Substrates, Thermal Mgmt, Film Assisted Molding & more. Discuss RF/MW & other challenges. Book a meeting: lp.pcb-technologies.com/imaps-symposiu… #IMAPS2025
𝗦𝗲𝗲 𝘂𝘀 𝗶𝗻 𝗮𝗰𝘁𝗶𝗼𝗻 𝗮𝘁 𝘁𝗼𝗽 𝗴𝗹𝗼𝗯𝗮𝗹 𝗲𝘃𝗲𝗻𝘁𝘀! PCB Technologies showcases advanced PCB, PCBA, Miniaturization & IC Packaging solutions for Defense, Aerospace, Medical & more. Meet us at IMAPS, EuMW, PCB West & InterPACK!
𝗗𝗶𝘀𝗰𝗼𝘃𝗲𝗿 𝗮𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀 𝘄𝗶𝘁𝗵 𝗣𝗖𝗕 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝘀 𝗮𝘁 𝗯𝗼𝗼𝘁𝗵 𝗡11-160, 𝗗𝗦𝗘𝗜 𝗨𝗞 2025 Experience PCB, PCBA, Miniaturization & IC Packaging in action + custom solutions. Schedule your meeting: lp.pcb-technologies.com/dsei-uk-2025
Die Stacking is transforming IC packaging — enabling smaller, smarter, and faster devices. At iNPACK, we combine in-house PCB, substrate, and system-level expertise to deliver fully integrated OSAT solutions. Miniaturization starts here. 👉 Read more: shorturl.at/nBoRG
𝗪𝗛𝗔𝗧 𝗔 𝗚𝗥𝗘𝗔𝗧 𝗧𝗨𝗥𝗡𝗢𝗨𝗧 𝗔𝗧 𝗜𝗠𝗦 2025! We were honored to welcome so many knowledgeable visitors seeking our expertise . Now, let’s keep in touch. We’re available to help launch your next project quickly, accurately & cost-effectively >> shorturl.at/XRi5X
JOIN US @IMS 2025,JUNE 17-19:BOOTH#1227 iNPACK will be showcasing solutions for Custom IC Packaging, Substrates, Thermal Management & a variety of options like Film Assisted Molding. Come to talk about RF/MW applications & other issues Schedule a meeting >>shorturl.at/HbRtP
JOIN US @IMS 2025,JUNE 17-19:BOOTH#1227 iNPACK will be showcasing solutions for Custom IC Packaging, Substrates, Thermal Management & a variety of options like Film Assisted Molding. Come to talk about RF/MW applications & other issues Schedule a meeting >>shorturl.at/HbRtP
Thank you @APEC_Conf 2025 for an amazing turnout! iNPACK powers your next project with high-performance IC packaging (Flip Chip, 2.5D, 3D & more). Let's collaborate–onsite or online–to innovate faster, cost-effectively. Contact us! pcb-technologies.com/contact-us/
Discover how 𝐈𝐂 𝐬𝐮𝐛𝐬𝐭𝐫𝐚𝐭𝐞𝐬 & 𝐜𝐡𝐢𝐩𝐥𝐞𝐭 𝐢𝐧𝐭𝐞𝐠𝐫𝐚𝐭𝐢𝐨𝐧 are powering the next generation of microelectronics. Explore the full article now: pcb-technologies.com/article/ic-sub… #ICPackaging #Chiplets #OgranicSubstrate
Explore the key differences between Panel-Level Packaging (PLP) & Wafer-Level Packaging (WLP) in our latest blog. Learn how iNPACK leverages PLP for high-volume production, thermal performance, & advanced SiP integration. 𝐋𝐞𝐚𝐫𝐧 𝐦𝐨𝐫𝐞>> pcb-technologies.com/article/panel-…
To PCB Technologies’ valued Customers, Partners and Employees the world over — Thanks for sharing our dedication to innovation, quality and service. Wishing you Health, Happiness and Success in the coming year.
Discover the key to reliable #WireBonding in semiconductor packaging! Learn about techniques, materials, and how to optimize for your application. Read more: pcb-technologies.com/article/an-in-… #Semiconductor #ICPackaging #ElectronicsManufacturing #SemiconductorPackaging
RF system designers know Antenna-in-Package (AiP) technology can provide a superior solution. See more >> pcb-technologies.com/article/the-ti… #rfpackage #rfantenna #rfcommunication #pcbassembly #pcbmanufacturing #pcbmanufacturer #pcbminiaturization
Die Stacking Technology (or 3D Stacking) involves vertically layering semiconductor dies in a single IC package. This advanced method boosts design & manufacturing possibilities beyond traditional 2D models. 𝐒𝐞𝐞 𝐦𝐨𝐫𝐞>> pcb-technologies.com/article/die-st… #Diestacking #ICPackaging
Die Stacking Technology (or 3D Stacking) involves vertically layering semiconductor dies in a single IC package. This advanced method boosts design & manufacturing possibilities beyond traditional 2D models. 𝐒𝐞𝐞 𝐦𝐨𝐫𝐞 >> pcb-technologies.com/article/die-st… #Diestacking #ICPackaging
Amazing turnout at #IMAPS Symposium! The #iNPACK team was excited to meet so many visitors & discuss your packaging needs. Now that we’ve connected, let’s keep it going. We're ready to help launch your next project, quickly & efficiently. Reach out today! pcb-technologies.com/article/meet-u…
Visit #iNPACK Booth #507 at the #IMAPS Symposium to meet our team and discover the future of IC Packaging Solutions, including: -High Performance/Reliability -Flip Chip, 2.5D, 3D -Custom Substrate Design Can't attend? Connect with us virtually! pcb-technologies.com/article/meet-u…
Entire range of IC Packaging types with descriptions, key features, applications + new developments. See more > pcb-technologies.com/article/range-… #ICPackaging #AdvancedSemiconductors #ElectronicsManufacturing #ChipDesign #SemiconductorPackaging
Join #iNPACK at the #IMAPS Symposium, Booth #507! Meet our tech team to explore the latest IC packaging, including: High Performance & Reliability Flip Chip, 2.5D, 3D Solutions Custom Substrate Design Can’t attend? Connect with us virtually or in person. pcb-technologies.com/article/meet-u…
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