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#heterogeneousintegration 検索結果

Merck_Elec's profile picture. At the Electronics business of Merck, we are the company behind the companies advancing digital living. Not intended for US and Canadian visitors.
Merck Electronics
 @Merck_Elec
2023/10/19

We have identified six key technology trends and are actively expanding our business potential to address them. Share your thoughts in the comments! #Sustainability #DisaggregatedComputing #HeterogeneousIntegration #Metaverse #AR #VR #Photonics #Neuromorphiccomputing

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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2023/10/12

It was an IMAPS conference to remember. From ASE's side, there was Dr. William Chen's inspiring #heterogeneousintegration talk, which featured his trademark retrospective and futuristic rumination on the innovation #roadmapshaping our industry. Then there was Dr. CP Hung's…

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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
/04/11

At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.

AmkorTechnology's tweet image. At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.
AmkorTechnology's tweet image. At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.
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FINEPLACER's profile picture. A leading manufacturer of equipment for sub-micron precision bonding and advanced SMD rework. Berlin·Phoenix·New Hampshire·Shanghai·Tokyo·Penang.
Finetech
 @FINEPLACER
2023/07/20

Excited to be exhibiting at CHIPcon in San Jose, CA July 24-27. This leading global event focuses on #Chiplet and #HeterogeneousIntegration Packaging. Stopy by our booth to find your application solution! #Microelectronics #DieBonding #DieBonder #DieAttach #IMAPS #Finetech

FINEPLACER's tweet image. Excited to be exhibiting at CHIPcon in San Jose, CA July 24-27. This leading global event focuses on #Chiplet and #HeterogeneousIntegration Packaging. Stopy by our booth to find your application solution! #Microelectronics #DieBonding #DieBonder #DieAttach #IMAPS #Finetech
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2023/08/01

At the iMAPS #CHIPcon 2023 conference, ASE's Tilson Chung shared his thoughts on next generation #5G mmWave module architecture, and the role of #heterogeneousintegration to achieve the performance breakthroughs our connected world needs. #chiplets #VIPack #advancedpackaging

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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2024/07/25

Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.

AmkorTechnology's tweet image. Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.
AmkorTechnology's tweet image. Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.
AmkorTechnology's tweet image. Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2023/10/20

There were many special moments this week at #OCPSummit23, and here's just one of them: ASE's Dr. Bill Chen sharing that his motivation for the #HeterogeneousIntegration Roadmap is to inspire, encourage, and raise up new talent in the ever-evolving #advancedpackaging space.…

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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
/02/08

At Auto World 2025, Amkor's WonChul Do presented to a packed room eager to learn about #HeterogeneousIntegration through advanced packaging. His talk explored how these technologies enable high performance & energy efficiency in the AI era, from Data Centers to connected devices.

AmkorTechnology's tweet image. At Auto World 2025, Amkor's WonChul Do presented to a packed room eager to learn about #HeterogeneousIntegration through advanced packaging. His talk explored how these technologies enable high performance & energy efficiency in the AI era, from Data Centers to connected devices.
AmkorTechnology's tweet image. At Auto World 2025, Amkor's WonChul Do presented to a packed room eager to learn about #HeterogeneousIntegration through advanced packaging. His talk explored how these technologies enable high performance & energy efficiency in the AI era, from Data Centers to connected devices.
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SkyWaterFoundry's profile picture. The Trusted Innovation Partner defining the Technology Foundry Category. Visit https://t.co/QWRtACuN9h for more information.
SkyWater Technology Foundry
 @SkyWaterFoundry
2023/06/01

We had a great week at the #ECTC conference in Orlando talking to attendees about our #heterogeneousintegration capabilities. We're already looking forward to next year in Denver! #ectc2023 #advancedpackaging #technology

SkyWaterFoundry's tweet image. We had a great week at the #ECTC conference in Orlando talking to attendees about our #heterogeneousintegration capabilities. We're already looking forward to next year in Denver! #ectc2023 #advancedpackaging #technology
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2024/08/06

Amkor's HEEJUN JANG discusses how the S-Connect bridge platform is set to be a key solution for advanced HI packaging in his blog post, "Reliability Performance Of S-Connect Module (Bridge Technology) For #HeterogeneousIntegration Packaging." bit.ly/3Wzavww #Amkor

AmkorTechnology's tweet image. Amkor's HEEJUN JANG discusses how the S-Connect bridge platform is set to be a key solution for advanced HI packaging in his blog post, "Reliability Performance Of S-Connect Module (Bridge Technology) For #HeterogeneousIntegration Packaging." bit.ly/3Wzavww #Amkor
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2023/10/03

The #heterogeneousintegration theme was firmly in the spotlight at #EMPC2023, where ASE's Mark Gerber, Chen Oudi and Ricky Lee spoke to large audiences about how #advancedpackaging is enabling huge strides in #microelectronics innovation, from #5Gto #healthcare. As always, we…

aseglobal's tweet image. The #heterogeneousintegration theme was firmly in the spotlight at #EMPC2023, where ASE's Mark Gerber, Chen Oudi and Ricky Lee spoke to large audiences about how #advancedpackaging is enabling huge strides in #microelectronics innovation, from #5Gto #healthcare. As always, we…
aseglobal's tweet image. The #heterogeneousintegration theme was firmly in the spotlight at #EMPC2023, where ASE's Mark Gerber, Chen Oudi and Ricky Lee spoke to large audiences about how #advancedpackaging is enabling huge strides in #microelectronics innovation, from #5Gto #healthcare. As always, we…
aseglobal's tweet image. The #heterogeneousintegration theme was firmly in the spotlight at #EMPC2023, where ASE's Mark Gerber, Chen Oudi and Ricky Lee spoke to large audiences about how #advancedpackaging is enabling huge strides in #microelectronics innovation, from #5Gto #healthcare. As always, we…
aseglobal's tweet image. The #heterogeneousintegration theme was firmly in the spotlight at #EMPC2023, where ASE's Mark Gerber, Chen Oudi and Ricky Lee spoke to large audiences about how #advancedpackaging is enabling huge strides in #microelectronics innovation, from #5Gto #healthcare. As always, we…
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IMAPSorg's profile picture. Welcome to IMAPS, the international society bringing together the entire microelectronics assembly and advanced packaging supply chain
IMAPS
 @IMAPSorg
2023/06/27

CHIPcon 2023 is the top global event for advanced #Chiplet and #HeterogeneousIntegration Packaging. Early reg & hotel block end June 30. Save $100 on conference, PDCs and tabletops. Hotel reservations can be changed/cancelled up to 1 day before arrival. bit.ly/3XIztKh

IMAPSorg's tweet image. CHIPcon 2023 is the top global event for advanced #Chiplet and #HeterogeneousIntegration Packaging. Early reg & hotel block end June 30. Save $100 on conference, PDCs and tabletops. Hotel reservations can be changed/cancelled up to 1 day before arrival. bit.ly/3XIztKh
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AdabellIbarra's profile picture. Educación y Respeto deben ser las bases para reconstruir el país, por un México Unido, basta de división.
Adabell Casillas Ibarra
 @AdabellIbarra
2023/04/04

Creating real 3D IC designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. sie.ag/3ZDHFun #SemiconductorIndustry #Chiplets #HeterogeneousIntegration

AdabellIbarra's tweet image. Creating real 3D IC designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. sie.ag/3ZDHFun #SemiconductorIndustry #Chiplets #HeterogeneousIntegration
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2023/07/19

Amkor's Mike Kelly talks about a variety of issues ranging from uneven aging, #warpage, & different mechanical stresses, as well as some possible benefits. Watch the #techtalk here bit.ly/3pMheXM #Heterogeneousintegration #semiconductor #semiconductors#chiplet #chiplets

AmkorTechnology's tweet image. Amkor's Mike Kelly talks about a variety of issues ranging from uneven aging, #warpage, & different mechanical stresses, as well as some possible benefits. Watch the #techtalk here bit.ly/3pMheXM #Heterogeneousintegration #semiconductor #semiconductors#chiplet #chiplets
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Chip_Insider's profile picture. Editor In Chief of Semiconductor Engineering #semiconductor #semiEDA #AI #embedded #verification #lowpower #test #DataAnalytics #automotive #ICmanufacturing #ML
Ed Sperling
 @Chip_Insider
2024/11/06

Big Changes Ahead For Analog Design: In-house flows are unable to keep up with foundry PDKs & heterogeneous integration, but commercial EDA tools add their own set of challenges (part 2) semiengineering.com/big-changes-ah… #analog #heterogeneousintegration #semiconductor #semiEDA

Chip_Insider's tweet image. Big Changes Ahead For Analog Design: In-house flows are unable to keep up with foundry PDKs & heterogeneous integration, but commercial EDA tools add their own set of challenges (part 2) semiengineering.com/big-changes-ah… #analog #heterogeneousintegration #semiconductor #semiEDA
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Chip_Insider's profile picture. Editor In Chief of Semiconductor Engineering #semiconductor #semiEDA #AI #embedded #verification #lowpower #test #DataAnalytics #automotive #ICmanufacturing #ML
Ed Sperling
 @Chip_Insider
2024/10/24

Monolithic Vs. Heterogeneous Integration New processes, materials, & combinations of existing technologies will determine future directions for semiconductors semiengineering.com/monolithic-vs-… #semiconductor #heterogeneousintegration @GlobalFoundries @LamResearch @IBM @intel @Qualcomm

Chip_Insider's tweet image. Monolithic Vs. Heterogeneous Integration New processes, materials, & combinations of existing technologies will determine future directions for semiconductors semiengineering.com/monolithic-vs-… #semiconductor #heterogeneousintegration @GlobalFoundries @LamResearch @IBM @intel @Qualcomm
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SEMIconex's profile picture. SEMI connects the global electronics supply chain to promote its development and foster the collaboration and innovation vital to the growth of SEMI members.
SEMI
@SEMIconex
2023/07/11

The 3D & Systems Summit 2023 – held in late June in Dresden – gathered industry leaders and visionaries to provide insights into how #heterogeneousintegration is becoming a key driver of the #semiconductor industry’s success. Event highlights! 👉 bit.ly/3JT3Qrr

SEMIconex's tweet image. The 3D & Systems Summit 2023 – held in late June in Dresden – gathered industry leaders and visionaries to provide insights into how #heterogeneousintegration is becoming a key driver of the #semiconductor industry’s success. Event highlights! 👉 bit.ly/3JT3Qrr
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UCLACHIPS's profile picture. Center for Heterogeneous Integration and Performance Scaling
UCLA CHIPS
 @UCLACHIPS
2024/07/10

We're excited to share that Randall Irwin will be presenting a Demonstration of an Active, Flexible Connector for Signaling in Large Area Computational Systems. University of California, Los Angeles #HeterogeneousIntegration #SEMICONWest #SEMI-FlexTech

UCLACHIPS's tweet image. We're excited to share that Randall Irwin will be presenting a Demonstration of an Active, Flexible Connector for Signaling in Large Area Computational Systems. University of California, Los Angeles #HeterogeneousIntegration #SEMICONWest #SEMI-FlexTech
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raylabian's profile picture.
RAYLA BIAN
 @raylabian
/08/16

Advanced packaging hub in South Wales deployed 2,000 wafer-level fan-out slots/month, enabling heterogeneous integration of GPU, CPU, and memory dies .#AdvancedPackaging #HeterogeneousIntegration

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MacDermidAlpha's profile picture. MacDermid Alpha brings together the world’s best innovation and technical service to the electronics and surface finishing industries.
MacDermid Alpha Electronics Solutions
 @MacDermidAlpha
/07/07

Read this Q&A for an expert view on where advanced packaging is heading and the chemistry that is enabling next-generation interconnects: chipscalereview.com/wp-content/upl… #AdvancedPackaging #HeterogeneousIntegration #HybridBonding #SemiconductorPackaging #HighPerformanceComputing

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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
/04/11

At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.

AmkorTechnology's tweet image. At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.
AmkorTechnology's tweet image. At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
/02/18

At #SEMICONKorea2025, Amkor's TaeKyeong Kwang's "#Chiplets, #HeterogeneousIntegration through Advanced Packaging" presentation will dive into cutting-edge solutions that overcome traditional limitations and drive next-generation performance. Learn more at amkor.com

AmkorTechnology's tweet image. At #SEMICONKorea2025, Amkor's TaeKyeong Kwang's "#Chiplets, #HeterogeneousIntegration through Advanced Packaging" presentation will dive into cutting-edge solutions that overcome traditional limitations and drive next-generation performance. Learn more at amkor.com
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
/02/08

At Auto World 2025, Amkor's WonChul Do presented to a packed room eager to learn about #HeterogeneousIntegration through advanced packaging. His talk explored how these technologies enable high performance & energy efficiency in the AI era, from Data Centers to connected devices.

AmkorTechnology's tweet image. At Auto World 2025, Amkor's WonChul Do presented to a packed room eager to learn about #HeterogeneousIntegration through advanced packaging. His talk explored how these technologies enable high performance & energy efficiency in the AI era, from Data Centers to connected devices.
AmkorTechnology's tweet image. At Auto World 2025, Amkor's WonChul Do presented to a packed room eager to learn about #HeterogeneousIntegration through advanced packaging. His talk explored how these technologies enable high performance & energy efficiency in the AI era, from Data Centers to connected devices.
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Smoltek's profile picture. Making space for the next technology leap. Solving advanced material engineering challenges with nanotechnology. #semiconductors #hydrogen $SMOL
Smoltek
 @Smoltek
2019/03/27

Idag skriver @dagensnyheter om Smoltek och hur vi hittar lösningar på de stora utmaningarna som teknikutvecklingen står inför idag. #nanotechnology #advancedengineering #heterogeneousintegration

Smoltek's tweet image. Idag skriver @dagensnyheter om Smoltek och hur vi hittar lösningar på de stora utmaningarna som teknikutvecklingen står inför idag. #nanotechnology #advancedengineering #heterogeneousintegration
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Smoltek's profile picture. Making space for the next technology leap. Solving advanced material engineering challenges with nanotechnology. #semiconductors #hydrogen $SMOL
Smoltek
 @Smoltek
2019/03/25

Don't miss out on an opportunity to get some insight on the new wave of carbon nanotech that will drive the future of microprocessors. See you wednesday March 27 in Gothenburg? Registration is free. #Nanotechnology #advancedengineering #heterogeneousintegration #Semiconductors

Smoltek's tweet image. Don't miss out on an opportunity to get some insight on the new wave of carbon nanotech that will drive the future of microprocessors. See you wednesday March 27 in Gothenburg? Registration is free. #Nanotechnology #advancedengineering #heterogeneousintegration #Semiconductors
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2021/09/08

Powerful words today from @intel's Dr. Babak Sabi who emphasized, "#HeterogeneousIntegration is undeniably the vehicle to drive continued advances in #compute and #communications." Clearly, innovation in #AdvancedPackaging has become critical. #AI #5G #IoT #Automotive #DataCenter

aseglobal's tweet image. Powerful words today from @intel's Dr. Babak Sabi who emphasized, "#HeterogeneousIntegration is undeniably the vehicle to drive continued advances in #compute and #communications." Clearly, innovation in #AdvancedPackaging has become critical. #AI #5G #IoT #Automotive #DataCenter
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
/04/11

At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.

AmkorTechnology's tweet image. At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.
AmkorTechnology's tweet image. At ISES USA 2025, Amkor's Roger St. Amand presented how chiplet architectures & adv packaging are driving compute performance evolution. His talk explored innovations enabling commercial AI acceleration & how #heterogeneousintegration overcomes limitations of traditional scaling.
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2023/03/03

Join Amkor at the #MEPTEC webinar "Not Just Chips" on April 4-6. bit.ly/3J9ayIX This free workshop will explore the challenge associated with everything other than the #chips which are pulled together to make today’s leading-edge #heterogeneousintegration a reality.

AmkorTechnology's tweet image. Join Amkor at the #MEPTEC webinar "Not Just Chips" on April 4-6. bit.ly/3J9ayIX This free workshop will explore the challenge associated with everything other than the #chips which are pulled together to make today’s leading-edge #heterogeneousintegration a reality.
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SEMIconex's profile picture. SEMI connects the global electronics supply chain to promote its development and foster the collaboration and innovation vital to the growth of SEMI members.
SEMI
@SEMIconex
2019/09/20

#SEMICONTaiwan thumbs up from the Day 3 speakers #HeterogeneousIntegration. Call from HIR Chair Bill Chen "HIR is for everyone...there is a huge need for pre-competitive collaboration to take these big steps in technology for our industry. It benefits us all." #ThoughtLeadership

SEMIconex's tweet image. #SEMICONTaiwan thumbs up from the Day 3 speakers #HeterogeneousIntegration. Call from HIR Chair Bill Chen "HIR is for everyone...there is a huge need for pre-competitive collaboration to take these big steps in technology for our industry. It benefits us all." #ThoughtLeadership
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2023/07/19

Amkor's Mike Kelly talks about a variety of issues ranging from uneven aging, #warpage, & different mechanical stresses, as well as some possible benefits. Watch the #techtalk here bit.ly/3pMheXM #Heterogeneousintegration #semiconductor #semiconductors#chiplet #chiplets

AmkorTechnology's tweet image. Amkor's Mike Kelly talks about a variety of issues ranging from uneven aging, #warpage, & different mechanical stresses, as well as some possible benefits. Watch the #techtalk here bit.ly/3pMheXM #Heterogeneousintegration #semiconductor #semiconductors#chiplet #chiplets
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2022/03/30

Amkor's Adrian Arcedera presented “#HeterogeneousIntegration for #MEMS and #Sensor Packages” at the MEMS World Summit Webinar: Titans. In his presentation, Adrian discussed the different solutions available from an #OSAT supplier and their advantages for MEMS & sensor products.

AmkorTechnology's tweet image. Amkor's Adrian Arcedera presented “#HeterogeneousIntegration for #MEMS and #Sensor Packages” at the MEMS World Summit Webinar: Titans. In his presentation, Adrian discussed the different solutions available from an #OSAT supplier and their advantages for MEMS & sensor products.
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2021/12/09

At #SEMICONWest, expert panelists explored 'SiP and #Chiplets in the #HeterogeneousIntegration of Electronic Systems', surmising how both are enabling unprecedented innovation, from #medical to #mobility. Great photos from @SEMIAmericas VP Tom Salmon, HIR co-chair & superhero!

aseglobal's tweet image. At #SEMICONWest, expert panelists explored 'SiP and #Chiplets in the #HeterogeneousIntegration of Electronic Systems', surmising how both are enabling unprecedented innovation, from #medical to #mobility. Great photos from @SEMIAmericas VP Tom Salmon, HIR co-chair & superhero!
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2022/06/16

It’s a sign…..that ASE will participate in the partner pavilion at the annual TSMC Symposium tomorrow. If you’re planning to be there at the #SantaClara convention center, please stop by and learn about our new advanced packaging platform, #VIPack! #heterogeneousintegration

aseglobal's tweet image. It’s a sign…..that ASE will participate in the partner pavilion at the annual TSMC Symposium tomorrow. If you’re planning to be there at the #SantaClara convention center, please stop by and learn about our new advanced packaging platform, #VIPack! #heterogeneousintegration
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2024/08/06

Amkor's HEEJUN JANG discusses how the S-Connect bridge platform is set to be a key solution for advanced HI packaging in his blog post, "Reliability Performance Of S-Connect Module (Bridge Technology) For #HeterogeneousIntegration Packaging." bit.ly/3Wzavww #Amkor

AmkorTechnology's tweet image. Amkor's HEEJUN JANG discusses how the S-Connect bridge platform is set to be a key solution for advanced HI packaging in his blog post, "Reliability Performance Of S-Connect Module (Bridge Technology) For #HeterogeneousIntegration Packaging." bit.ly/3Wzavww #Amkor
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SemiEngineering's profile picture. Deep Insights For The Tech Industry #semiconductor #semiEDA #AI #embedded #verification #lowpower #test #DataAnalytics #automotive #chipdesign #ICmanufacturing
Semiconductor Engineering
 @SemiEngineering
2023/10/21

Heterogeneous Integration Finding Its Footing: SemiEngineering discusses heterogeneous integration with 5 industry experts semiengineering.com/heterogeneous-… #semiconductor @AmkorTechnology @PromexInc @Synopsys @Cadence @siemensindustry #chiplets #heterogeneousintegration #3DIC #UCIe

SemiEngineering's tweet image. Heterogeneous Integration Finding Its Footing: SemiEngineering discusses heterogeneous integration with 5 industry experts semiengineering.com/heterogeneous-… #semiconductor @AmkorTechnology @PromexInc @Synopsys @Cadence @siemensindustry #chiplets #heterogeneousintegration #3DIC #UCIe
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2024/07/25

Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.

AmkorTechnology's tweet image. Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.
AmkorTechnology's tweet image. Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.
AmkorTechnology's tweet image. Amkor's WonChul Do presented at the 2024 Korean Society of Electrical and Electronic Materials Summer Symposium. He presented on #AdvancedPackaging technology for #HeterogeneousIntegration & system performance improvement. Wonchul was also presented with a plaque of appreciation.
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AmkorTechnology's profile picture. Amkor provides #semiconductor design, assembly & test services. We offer advanced innovations in Wafer-Level Flip Chip, #MEMS, #SiP and AiP/AoP Packaging. $amkr
Amkor Technology
 @AmkorTechnology
2022/03/14

LAST CHANCE TO REGISTER - #Amkor is a proud sponsor of MEPTEC’s FREE online event "Road to #Chiplets – #HeterogeneousIntegration Testability" on March 15-16, 2022. Amkor's Vineet Pancholi will present “Test Impacts of Multi-Die Packages“. Register: lnkd.in/gRpd32uj

AmkorTechnology's tweet image. LAST CHANCE TO REGISTER - #Amkor is a proud sponsor of MEPTEC’s FREE online event "Road to #Chiplets – #HeterogeneousIntegration Testability" on March 15-16, 2022. Amkor's Vineet Pancholi will present “Test Impacts of Multi-Die Packages“. Register: lnkd.in/gRpd32uj
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SEMIconex's profile picture. SEMI connects the global electronics supply chain to promote its development and foster the collaboration and innovation vital to the growth of SEMI members.
SEMI
@SEMIconex
2020/02/22

Ready for Day 2 of the #heterogeneousintegration Roadmapping? We are starting with "the rise of #chiplets" from @Intel and the Open Domain-Specific Architecture project. #semiconductors #thoughtleadership #SEMI50

SEMIconex's tweet image. Ready for Day 2 of the #heterogeneousintegration Roadmapping? We are starting with "the rise of #chiplets" from @Intel and the Open Domain-Specific Architecture project. #semiconductors #thoughtleadership #SEMI50
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aseglobal's profile picture. Official account of ASE Inc | ASE Tech Holding Co (NYSE: ASX. TWSE: 3711) #VIPACK #HeterogeneousIntegration #chiplets #SysteminPackage #3DIC
ASE
@aseglobal
2022/03/09

The ASE technology team are all present and correct at the IMAPS #DPC2022 this week after a two-year hiatus. We are ready to share perspectives and discuss opportunities across #HeterogeneousIntegration, SiP & #Chiplets, towards a brighter future ahead.#IoT #5G #Automotive #HPC

aseglobal's tweet image. The ASE technology team are all present and correct at the IMAPS #DPC2022 this week after a two-year hiatus. We are ready to share perspectives and discuss opportunities across #HeterogeneousIntegration, SiP & #Chiplets, towards a brighter future ahead.#IoT #5G #Automotive #HPC
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SEMIconex's profile picture. SEMI connects the global electronics supply chain to promote its development and foster the collaboration and innovation vital to the growth of SEMI members.
SEMI
@SEMIconex
2020/02/17

What's a better way to kick off #NationalEngineersWeek than by attending the 3rd Annual #HeterogeneousIntegration Roadmap meeting on February 20-21 at SEMI HQ? bit.ly/2OVXqvh #SEMI50

SEMIconex's tweet image. What's a better way to kick off #NationalEngineersWeek than by attending the 3rd Annual #HeterogeneousIntegration Roadmap meeting on February 20-21 at SEMI HQ? bit.ly/2OVXqvh #SEMI50
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intevac_inc's profile picture. We leverage our extensive knowledge of thin-film vacuum technologies and optical sensors in order to deliver value to our customers.
Intevac
 @intevac_inc
2018/07/12

Who got these #HeterogeneousIntegration packaging experts to form such a neat line after their session today @SEMIconex #SemiconWest? Ask Patricia @asegroup_global for details. Or maybe @3DInCites knows?

intevac_inc's tweet image. Who got these #HeterogeneousIntegration packaging experts to form such a neat line after their session today @SEMIconex #SemiconWest? Ask Patricia @asegroup_global for details. Or maybe @3DInCites knows?
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SEMIconex's profile picture. SEMI connects the global electronics supply chain to promote its development and foster the collaboration and innovation vital to the growth of SEMI members.
SEMI
@SEMIconex
2023/07/11

The 3D & Systems Summit 2023 – held in late June in Dresden – gathered industry leaders and visionaries to provide insights into how #heterogeneousintegration is becoming a key driver of the #semiconductor industry’s success. Event highlights! 👉 bit.ly/3JT3Qrr

SEMIconex's tweet image. The 3D & Systems Summit 2023 – held in late June in Dresden – gathered industry leaders and visionaries to provide insights into how #heterogeneousintegration is becoming a key driver of the #semiconductor industry’s success. Event highlights! 👉 bit.ly/3JT3Qrr
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